With a 45 year + heritage Micross Components began transforming specialty electronics by creating a global company with the broadest offering of products and services in the industry and quickly became recognized as the leading worldwide single-source supplier of specialty microelectronic components designed and manufactured to the highest quality standards.

Over the years, Micross Components acquired the specialized knowledge of these regional industry leaders to create a single-source solution for integrated circuits of all types and interconnect options.

Summary:

We are seeking a knowledgeable, self-motivated engineer for our growing process engineering team. This position will focus on supporting advanced packaging processing and process development, for, but not limited to, silicon interposer fabrication, through silicon via (TSV) fabrication, wafer bumping and micro-bumping, package assembly, and integrating a combination of interconnect technologies together. The successful candidate will have a working knowledge of wafer processing technologies, including thin film material deposition of metals, spin-on resists and polymers, photolithography, and wet chemical processes. This position will support technical tasks for new and existing customer needs, which includes hands-on processing, task management, and potentially lot management in our microfabrication facility.

Essential Duties & Responsibilities:

• Operation of semiconductor processing equipment
• Hands-on processing related to dry and wet etching, photolithography, electroplating, spin-on polymers, wire bonding, thermocompression bonding, solder column attach, and thin film deposition.
• Collect data and report out to supervisor or lab manager
• Support and write segments, as needed, for process specifications and process operation steps

Other Duties & Responsibilities:

• Comply with all safety policies, practices and procedures.
• Comply with all quality and ITAR policies, practices and procedures.
• Build meaningful and productive relationships with internal business partners.
• Participate in proactive team efforts to achieve program and company goals.
• Contribute to building a positive team spirit.
• Communicate effectively with all levels of employees.
• Protect confidential information by not communicating, disclosing to, or using for benefit of 3rd parties.
• Maintain the highest degree of honesty and integrity at all times.
• Perform other duties as assigned.

Job Qualifications:

• Semiconductor wafer processing experience in a cleanroom environment is a must
• Due to export control rules, must be a US Person
• B.S or M.S. in physical science or engineering
• 3+ years of job experience is a plus
• Excellent hands-on laboratory skills
• Excellent written and verbal communication skills
• PC proficiency is a must
• Extensive experience and working knowledge of Word, EXCEL, and PowerPoint is a must

Job Skills:

• Experience working with engineers and management at multiple levels in a dynamic work environment is desired
• Proficient technical writing is a must
• Experience with wafer-level packaging or 3DHI technologies is a plus
• Experience with CAD or photomask layout is a plus
• Overall experience with metrology measurements, data recording, and generation of control charts and statistical process control is also a plus

At Micross, our Core Values of integrity, communication, teamwork, quality and execution, self-discipline and accountability are cultivated throughout all levels of the organization. Micross provides a challenging and enjoyable workplace for members and supports the needs of the community.

Micross provides competitive benefits including medical, HSA and FSA plans, dental, vision, company paid basic Life Insurance, Employee Assistance Program (EAP), 401k with employer match, paid leave, vacation, holidays, generous tuition assistance, 529 College Savings, Pet insurance, Legal insurance, and a range of well-being programs available.

www.Micross.com