TITLE: PLATING PROCESS TECHNICIAN

FLSA STATUS: NON-EXEMPT

A SHIFT: MONDAY TO WEDNESDAY AND EVERY OTHER THURSDAY,6:00AM-6:00PM

REPORTS TO: DIRECTOR, PLATING PROCESS ENGINEERING

SUMMARY:

Under the direction of the Manager of Plating Process Engineering, the Plating Process Technician provides support to the engineering teams in the plating area, including assisting with wet etch process, preparing and maintaining recipes, reviewing and documenting process or procedures, and expediting and dispositioning prototype wafers; maintains process controls using Statistical Process Control (SPC), collects and analyzes data, and recommends corrective action. This position is located in Milpitas, California.

ESSENTIAL FUNCTIONS:

• Provides support to the engineering teams in the plating, wet etch, and stripping process areas
• Supports the plating, wet etch, and stripping processes by preparing, maintaining, and setting up recipes to ensure an efficient and consistent process
• Reviews and documents processes and procedures; partners with engineering to implement changes effectively
• Expedites and dispositions prototype wafers in the plating, wet etch and stripping areas
• Assists engineers to run plating process development experiments, collects and analyzes data, and recommends corrective action if required
• Reviews and maintains process controls using SPC and prepares charts and graphs
• Assists with routine troubleshooting and resolves basic process-related issues
• Participates in and recommends modifications to procedures or processes in support of continuous improvement initiatives
• Collaborates with Engineering to qualify or approve new processes or procedures
• Creates reports, charts, or graphs on an ad-hoc or routine basis
• Prepares daily pass down report for engineers, next shift plating process technicians, and manufacturing plating technicians
• Responds to inquiries from other team members, managers, or departments
• Adheres to all safety policies and procedures as required
• Performs other duties of a similar nature or level*

MINIMUM QUALIFICATIONS:

• Associates degree in Electronics or Industrial Technology and/or equivalent relevant experience
• Two years of experience working in the semiconductor industry
• Knowledge of plating, wet processes and procedures
• Hands on experience using metrology tools such as pH meter, Tencor Thickness Profiler, XRF, and B-H loop tools
• Proficient in the use of Microsoft Office Applications

Required Knowledge, Skills, and Abilities:

• Knowledge of semiconductor or hard disk drive (HDD) principles and processes
• Knowledge and ability to use SPC to maintain process controls
• Knowledge of plating, wet processes and procedures
• Ability to collect and analyze data, present findings, and recommend corrective action
• Ability to adhere to all safety policies and procedures
• Ability to communicate effectively with all levels of employees and management
• Demonstrated ability to follow routine verbal or written instructions
• Demonstrated problem solving and organizational skills
• Demonstrated time management and prioritization skills
• Skilled at resolving issues quickly and efficiently
• Flexible and able to prioritize

The hourly rate for this full-time position is between $26.00-$35.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The hourly pay range shown is subject to change and may be modified periodically.

WORKING CONDITIONS:

The Plating Process Technician works primarily in an indoor environment on a rotating schedule (A, B, C, or D shift). The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask. May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of workday; Stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. Must be able to load and unload various wet etch chemical solutions several times per shift. May be required to push, pull, or lift up to 25 pounds.

• Other duties of a similar nature or level are duties that may be required but may not be specifically listed in the job description or posting.

TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.