Job Details:

Job Description:

The Role and Impact

Join Intel's Advanced Packaging Substrate Technology Development team as a Packaging Module Development Engineer and play a pivotal role in shaping the future of advanced packaging solutions. You will be at the forefront of developing cutting-edge assembly processes and equipment that enable Intel's roadmap for innovative assembly packaging technologies. In this role, you will contribute to optimizing manufacturing processes, improving product quality, reliability, and yield, while pushing the boundaries of technology to meet the demands of a rapidly evolving semiconductor industry. You will collaborate with cross-functional teams, explore innovative solutions, and drive breakthroughs in packaging technology that directly impact Intel's success in the global market.

This position is ideal for candidates who enjoy hands-on engineering work and are interested in developing as a Tool Owner and Process Owner within Intel's advanced manufacturing environment.

Key Responsibilities

• Develop and support advanced assembly processes and equipment for next-generation substrate packaging technologies.
• Plan and execute Design of Experiments (DOEs) to support process optimization and evaluate process, material, and equipment interactions.
• Apply statistical analysis and data-driven methodologies to improve quality, reliability, process capability, manufacturing efficiency, and cost.
• Partner with Procurement and Supplier Quality teams to establish material specifications and support supplier performance and material quality.
• Contribute to process improvements through continuous improvement methodologies and engineering best practices.
• Troubleshoot packaging and manufacturing issues using engineering principles and analytical problem-solving techniques.
• Collaborate with cross-functional teams to resolve process and technology challenges supporting substrate technology development.
• Support process documentation, standardization activities, and preventive and corrective maintenance procedures.
• Work with equipment and material suppliers to support the development and qualification of new tools and materials.
• Contribute to the design, development, and qualification of advanced substrate packaging technologies, including EMIB and Co-EMIB.

Behavioral Traits

In addition to the qualifications listed below, the ideal candidate should demonstrate the following:

• Passion for hands-on manufacturing and working in a factory environment.
• Strong desire to learn and grow as a tool owner and process owner.
• Self-motivated with a continuous learning mindset.
• Strong problem-solving and analytical thinking skills.
• Effective written and verbal communication skills.
• Ability to collaborate with cross-functional teams.
• Adaptability and willingness to work in a fast-paced manufacturing environment.
• Genuine interest in building a long-term career with Intel.

Qualifications:

Minimum Qualifications

• Candidates must meet one of the following education and experience requirements:
• Bachelor's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or a related engineering discipline with 1+ year of relevant experience.
• Master's degree in one of the above disciplines with no prior experience required.
• PhD in one of the above disciplines with no prior experience required.

Required Technical Qualifications

• Knowledge of manufacturing process control and equipment adjustment.

Preferred Qualifications

• Experience with Design of Experiments (DOE) principles and statistical data analysis.
• Experience with Statistical Process Control (SPC).
• Experience using process development or statistical analysis tools such as JMP or Python.
• Experience troubleshooting engineering or manufacturing processes while collaborating with cross-functional teams.
• Background in organic and inorganic materials and characterization techniques such as DSC, TGA, FTIR, XPS, SEM, or similar.
Familiarity with machine learning techniques and relational databases for data analysis and modeling.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers - from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .

Annual Salary Range for jobs which could be performed in the US: $115,110.00-162,500.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.