The first round was a technical test which consisted of 19 MCQ(aptitude, pseudocodes, Java/c/c++ code snippets, ML (mainly regression)) and 1 coding question (moderate level). Second round was an interview which went for almost 40-45 minutes for me. Alot of situational kind of questions were asked (Tell me about a time when you solved a challenging task, how did you solve?, Did you ever have any conflict with your teammate, how did you resolve that?, A work that you did in a team?, what are you proud of yourself). How do you fit in this role being a mechanical engineer?, why did you choose thermal engineering? what is thermal engineering?, Most of the questions i answered by relating it to my work experience). then they asked about my project and the skills i had added in the resume (SQL, Python, scientific programming, ML). Then they asked me very basics of C++( stacks, queues, linked list and pointer). They also asked me to write an algorithm (pseudocode) to print a * pattern (easy), and Fibonacci series and then again, a different * pattern. then they asked about machine learning and how i am using it in my project. at the end of the interview, they asked me a puzzle (very easy)