Intel Corporation PTD Module and Yield Integration Engineer interview questions

Three Part Process 1st Part-Initial screening: forwarded my resume to an email that was circulated in our department from Intel. (All other forms of forwarding did not work!!) 2nd Part-Technical Interview: After about one week of forwarding the resume, I received an email from one of the technical stuff asking for a technical interview. It was an hr long interview with questions from topics related to my PhD, instruments that I used, basic principles of them, troubleshooting experience, equipment ownership, problem solving etc. 3rd part- Onsite interview: after 3 days of the technical, I was invited for an onsite interview which happened after one month. It gave me plenty of time to prepare for it. It was a day long interview with a 45 min presentation at the beginning of the day, then 30-45 mins one-one interview with different member of the technical team. It was a pleasant experience for me. I really enjoyed talking to them as it felt more like a conversation. Questions were similar to the technical interview. Make sure you know everything that you have put into your resume. During lunch, three members of the technical team escorted me and gave me a broad overview on the lifestyle, benefits, vacations, leaves, work stress etc. At the end of the day, the final interview was with hiring manager who basically gave a brief overview of the different component of TD department and how it fits into broader picture of Intel. At the end, the manager hinted me that if they would not select me, I would know by a week, otherwise, I will hear back from HR in 2-4 weeks time. In the 4th week, I received an offer from them.