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Fabtex™ Yield Optimizer uses AI, digital twins, and in-line fab data to reduce variability, save weeks in process tuning, and minimize wafer waste. Faster results and real-world impact. Check it out.
Driving Yield at Scale: Fabtex Yield Optimizer Improves Processes for High-Volume Manufacturing
Chips don’t just happen. They’re built with the right tools. Our technology helps manufacturers meet the demands of our everyday devices. Explore the “Made by Lam” tools and resources blog for more info on our technologies.
Made by Lam: Lam Tools and Technologies Resource Hub
Curious about advanced packaging and its role in the semiconductor industry? On the blog, we break down the basics of advanced packaging — a key driver of microchip performance and efficiency. Learn how techniques like 3D stacking and chiplet-based solutions enable smaller and more powerful chips.
What Is Advanced Packaging? (Semi 101)
AI relies on memory engineered for speed and scale. High bandwidth memory (HBM) stacks layers and connects them with microscopic precision — and we provide the tools to make it possible. Learn more via the blog.
High-Bandwidth Memory Explained (Semi 101)
Molybdenum (Mo) hybrid metallization cuts via/line resistance by ~55% and reduces stress-induced voids, improving BEOL reliability. Using virtual fabrication and simulation, we mapped the optimal Mo via profiles to maximize performance without costly wafer experiments. Get the full rundown via the blog.
Breaking the Copper Bottleneck With Molybdenum Hybrid Metallization
Ultra-thick dielectric films are essential for today’s 3D chip architectures, but they come with challenges like cracks, voids, wafer bowing, and throughput limits. Our deposition tool VECTOR® TEOS 3D solves these challenges with precision deposition technology built for advanced packaging. Learn how via our blog.
Everything You Need to Know About VECTOR® TEOS 3D
How do you scale 3D NAND to 1,000 layers while reducing environmental impact? Lam Cryo™ 3.0 uses cryogenic etch technology to create ultra-precise memory channels that deliver higher storage density, improved efficiency, and lower energy use for the AI era. Read more via Engineeringness.
The Future of Flash Memory is Cooler than you Think
Tualatin isn’t just where we work — it’s where we build lasting partnerships. From mentoring students to supporting local nonprofits, our commitment goes beyond technology. As we plan for our next chapter of growth, we’re committed to continuing to invest in the people and programs that make this community thrive. Learn more.
Lam Research Expansion Reflects Decades of Commitment to Tualatin - Tualatin Life
The next big thing in semiconductor metallization is here. CVP and GM of ALD/CVD Metals Products, Dr. Kaihan Ashtiani, explained the transition from tungsten to Mo and how our ALTUS® Halo tool overcomes the challenges associated with Mo deposition on the Silicon Semiconductor podcast. Give it a listen.
Scaling 3D chips with molybdenum-based metallisation
No fab? No problem. With Semiverse® Solutions, we help students across the U.S. learn chipmaking virtually — building skills for the future, without needing cleanroom access. See how we help bridge the talent gap via our blog.
How Semiverse® Solutions Is Transforming Semiconductor Engineering Education in the United States